University of L'Aquila EMC Laboratory
Electromagnetic Compatibility Research Laboratory
  • [214] X. Gu, R. R.imolo-Donadio, Z. Yu, F. de Paulis, Y. H. Kwark, M. Cocchini, M. B. Ritter, B. Archambeault, A. Ruehli, J. Fan, C. Schuster, Fast Physics-Based Via and Trace Models for Signal and Power Integrity Co-Analysis, in Proc. of IEC DesignCon 2010, February 1-4, 2010, Santa Clara, USA.
  • [215] F. de Paulis, L. Raimondo, A. Orlandi, Signal integrity analysis of embedded planar EBG structures, in Proc. of Asia-Pacific EMC 2010, 12-16 April 2010, Beijing, China.
  • [216] J. Zhang, Q. B. Chen, Z. Yang, J. L. Drewniak, A. Orlandi, Physics-Based Via Model Development and Verification, in Proc. of Asia-Pacific EMC 2010, 12-16 April 2010, Beijing, China.
  • [217] A. Ciccomancini Scogna, C.-D. Wang, A. Orlandi, T.-L. Wu, Parallel-Plate Noise Suppression Using a Ground Surface Perturbation Lattice (GSPL) Structure, in Proc. of Asia-Pacific EMC 2010, 12-16 April 2010, Beijing, China.
  • [218] R. J. Telleria, F. Silva, A. Orlandi, H. Sasse, A. Duffy, Factors influencing the successful validation of transient phenomenon modelling, in Proc. of Asia-Pacific EMC 2010, 12-16 April 2010, Beijing, China.
  • [219] V. Ricchiuti, F. de Paulis, A. Orlandi, Performance of signal link paths in presence of signal reference planes of EBG type, in Proc. of IEEE Workshop on Signal Propagation on Interconnects 2010, SPI 10, May 9-12, 2010, Hildesheim, Germany.
  • [220] G. Antonini, A. Orlandi, L. Raimondo Advanced Models for Signal Integrity and Electromagnetic Compatibility-Oriented Analysis of Nano-Interconnects, IEEE Transaction on Electromagnetic Compatibility, Special Issue on Signal Integrity, Vol. 52, no. 2, pp. 447-454, May 2010.
  • [221] F. de Paulis, L. Raimondo, D. Di Febo, B. Archambeault, S. Connor, A. Orlandi, Experimental Validation of Common-Mode Filtering Performances of Planar Electromagnetic Band-gap Structures, in Proc. of IEEE International Symposium on Electromagnetic Compatibility, July 25-30, 2010, Ft. Lauderdale USA.
  • [222] F. de Paulis, L. Raimondo, A. Orlandi, L. Ren, J. Fan, Equivalent Circuit Models for Evaluation of Bandgap Limits for Planar Electromagnetic Bandgap Structures, in Proc. of IEEE International Symposium on Electromagnetic Compatibility, July 25-30, 2010, Ft. Lauderdale USA.
  • [223] P. Tarquini, F. de Paulis, D. Di Febo, G. Antonini, A. Orlandi, V. Ricchiuti, Measurement of Differential Mode Propagation in Printed Circuit Board for Satellites Applications, in Proc. of IEEE International Symposium on Electromagnetic Compatibility, July 25-30, 2010, Ft. Lauderdale USA.
  • [224] J. Zhang, Q. B. Chen, K. Qiu, A. C. Scogna, M. Schauer, G. Romo, J. L. Drewniak, A. Orlandi Design and Modeling for Chip-to-Chip Communication at 20 Gbps, in Proc. of IEEE International Symposium on Electromagnetic Compatibility, July 25-30, 2010, Ft. Lauderdale USA.
  • [225] J. Zhang, Q. B. Chen, J. Fan, J. L. Drewniak, A. Orlandi, B. Archambeault DC Blocking Via Structure Optimization and Measurement Correlation for SerDes Channels, in Proc. of IEEE International Symposium on Electromagnetic Compatibility, July 25-30, 2010, Ft. Lauderdale USA.
  • [226] B. Archambeault, A. Duffy, H. Sasse, X. K. Li, M. Scase, M. Shafiullah, A. Orlandi, D. Di Febo, Challenges in developing a multidimensional Feature Selective Validation implementation, in Proc. of IEEE International Symposium on Electromagnetic Compatibility, July 25-30, 2010, Ft. Lauderdale USA.
  • [227] A. Ciccomancini Scogna, A. Orlandi, Systematic Analysis of the Signal Integrity Performance of Surface Integrated Waveguide structures (SIWs), in Proc. of IEEE International Symposium on Electromagnetic Compatibility, July 25-30, 2010, Ft. Lauderdale USA.
  • [228] F. de Paulis, L. Raimondo, A. Orlandi, Impact of shorting vias placement on embedded planar electromagnetic bandgap structures within multilayer printed circuit boards, IEEE Transaction on Microwave Theory and Techniques, vol. 58, no. 7, pp. 1867-1876, July 2010.
  • [229] T. L. Wu, J. Fan, F. de Paulis, C. D. Wang, A. Ciccomancini, A. Orlandi, Mitigation of noise coupling in multilayer high-speed PCB: state of the art modeling methodology and EBG technology, IEICE Trans. on Communications, Vol. E93-B, no. 7, pp. 1678-1689, July 2010.
  • [230] F. de Paulis, L. Raimondo, A. Orlandi, IR-Drop analysis and thermal assessment of planar electromagnetic band-gap structures for power integrity applications, IEEE Transaction on Advanced Packaging, vol. 33, no. 3, pp. 617-622, August 2010.
  • [231] R. Ferrauto, F. de Paulis, E. Ippoliti, F. Vasarelli, U. Di Marcantonio, A. Orlandi, G. Antonini, Block analysis of a voltage supply chain: mixed electromagnetic modeling and validation, IEEE Transaction on Electromagnetic Compatibility, vol. 52, no. 3, pp. 629-639, August 2010.