University of L'Aquila EMC Laboratory
Electromagnetic Compatibility Research Laboratory
  • [181] A. Duffy, A.Orlandi, A statistical toolkit for validation, in Applied Computational Electromagnetics (ACES) Journal, Vol. 23, n. 1, March 2008.
  • [182] A. Duffy, A.Orlandi, H.Sasse, Offset Difference Measure (ODM) Enhancement for the Feature Selective Validation (FSV) Method, in IEEE Transactions on Electromagnetic Compatibility, vol. 50, n. 2, May 2008.
  • [183] A.Cicomancini Scogna, A.Orlandi, Signal and Power Integrity Performances of Striplines in Presence of 2D EBG planes, in Proc. of 12th IEEE Workshop on Signal Propagation on Interconnects, Avignon, France, May 12-15, 2008.
  • [184] V.Ricchiuti, A.Orlandi, G.Antonini, High speed serial links characterization for ATCA backplanes, in Proc. of 12th IEEE Workshop on Signal Propagation on Interconnects, Avignon, France, May 12-15, 2008.
  • [185] A.Dominicis, A.Annunziata, A.Orlandi, G.Antonini, F.Fiammingo, C.Mazzetti, Protection of radar systems against nearby or direct lightning strokes, in Proc. of 2008 IEEE Radar Conference, Rome, 26-30 May, 2008.
  • [186] A.Ciccomancini, A.Orlandi, V.Ricchiuti, Signal Integrity analysis of single-ended and differential signaling in PCBs with EBG structure, in Proc. of 2008 IEEE Symposium on Electromagnetic Compatibility, Detroit, MI, USA, 18-22 August, 2008.
  • [187] A.Trave, A. Di Pasuale, G.Antonini, A.Orlandi, Comparing Full Lateral Metallization and Reference Plane Stitching in LTCC Boards for Satellite Applications, in Proc. of 2008 IEEE Symposium on Electromagnetic Compatibility, Detroit, MI, USA, 18-22 August, 2008.
  • [188] F. De Paulis, J. Diepenbrock, B. Archambeault, S. Connor, A. Orlandi, J. Fan, Link path design on a block-by-block basis, in Proc. of 2008 IEEE Symposium on Electromagnetic Compatibility, Detroit, MI, USA, 18-22 August, 2008.
  • [189] A.Orlandi, C.Polisini, G.Antonini, A.Duffy, H.Sasse, Progress in the Development of a 2D Feature Selective Validation (FSV) Method, in Proc. of 2008 IEEE Symposium on Electromagnetic Compatibility, Detroit, MI, USA, 18-22 August, 2008.
  • [190] A.Duffy, A.Orlandi, H.Nisanci, K.Armstrong, Signal Integrity Testing using Multiple Out-of-Band Sources in a Reverberation Chamber, in Proc. of 2008 IEEE Symposium on Electromagnetic Compatibility, Detroit, MI, USA, 18-22 August, 2008.
  • [191] G. Antonini, J. Zhang, M. Koledintseva, J. Drewniak, D. Pommerenke, R. DuBroff, Z. Yang, C. Rozanov, A. Orlandi, Reconstruction of dielectric material properties for dispersive substrates using a genetic algorithm, in IEEE Transactions on Electromagnetic Compatibility, vol. 50, n. 3, pp. 704-714, August 2008.
  • [192] P.Tognolatti, A.Orlandi, Analysis of the EMI Impact of an Array of Wind Generators on the Performances of Secondary Surveillance Radar System, in Proc. of EMC EUROPE 2008, International Symposium on EMC, Hamburg, Germany, September 8-12, 2008.
  • [193] V.Ricchiuti, A. Orlandi, J. L. Drewniak, F. De Paulis, Characterization of serial links at 5.5Gbps on FR4 backplanes, in Proc. of EMC EUROPE 2008, International Symposium on EMC, Hamburg, Germany, September 8-12, 2008.
  • [194] B.Archambeault, M. Cocchini, G. Selli, J. Fan, J. L. Knighten, S. Connor, and A.Orlandi, J. Drewniak, Design Methodology for PDN Synthesis on Multi-layer PCBs, in Proc. of EMC EUROPE 2008, International Symposium on EMC, Hamburg, Germany, September 8-12, 2008.
  • [195] J.Zhang, Q. B. Chen, Z. Qiu, J. L. Drewniak, A. Orlandi, Extraction of Causal RLGC Models from Measurements for Signal Link Path Analysis, in Proc. of EMC EUROPE 2008, International Symposium on EMC, Hamburg, Germany, September 8-12, 2008.
  • [196] X.Chang, B. Archambeault, M. Cocchini, F. De Paulis, V. Sivarajan, Y. Zhang, J. Fan, S. Connor, A. Orlandi, J. Drewniak, Return via Connections for Extending Signal Link Path Bandwidth of Via Transitions, in Proc. of EMC EUROPE 2008, International Symposium on EMC, Hamburg, Germany, September 8-12, 2008.